DOWSIL 3-6752 Thermally Conductive Adhesive
陶熙DOWSIL 3-6752灰色导热粘合剂是一种单组分热固化硅酮，用于冷却电子应用，并与金属、陶瓷、填充塑料、环氧树脂层压板和有机基材粘合。陶熙DOWSIL 3-6752灰色导热粘合剂具有阻燃性、自流平性、流动性、触变性，不含添加溶剂。
DOWSIL 3-6752 Thermally Conductive Adhesive
陶熙DOWSIL 3-6752灰色导热粘合剂是一种单组分热固化硅酮，用于冷却电子应用，并与金属、陶瓷、填充塑料、环氧树脂层压板和有机基材粘合。陶熙DOWSIL 3-6752灰色导热粘合剂具有阻燃性、自流平性、流动性、触变性，不含添加溶剂。
Typical Use: Used for bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are needed.
Brand: DOWSIL
Color: Gray
Components: 1 part
Cure Time: 40min @ 100 °C; 10min @ 125 °C; 3min @ 150 °C
Dielectric Strength: 400 V/mil
Elongation: 15%
Flash Point: >100 °C
Hardness: 87 A
Service Temperature: -45 to 200 °C
Shear Strength: 540
Specific Gravity: 2.6 @ 25 °C
Tensile Strength: 545 psi
Thermal Conductivity: 1.8 W/mK
Viscosity: 81,000
